• Standard Capability
      PCB Technologies
      Item Process Manufacturing Capability Remark Item Max Capability
      1 Surface Finishing

      HASL, HASL LF, ENIG, gold fingers plating, OSP, Immersion Ag, Immersion Sn, Carbon Ink, peelable mask, filling vias with resin

      		Buried and Blind Vias 2 steps
      2 Board Thickness 0.2 MM ~ 6.0 MM Sequential lamination Y
      3 Layers 1 ~ 28 L
      Mixed dielectric
      / Hybrid construction

      Aluminum-FR4, FR4-    Rogers，Flex-FR4

      4 Material

      KB,ITEQ,Shengyi,Huazheng,Nelco,Getek,CEM,Arlon,Rogers,Teflon,Polymide, Aluminum Base, Hilogen Free,Peters Soldermask, Taiyo Ink

      		Aluminum Back PCB Y

      TG:  low to high, TG135 to TG180

      		Carbon Ink hole plug Y
      5 Board Size

      Max board size：500 x 1200 MM; Min board size: 3*3 mm

      		Silver Paste hole plug Y
      6 Inner Layer

      (1) ring of line: single sided 4mil

      Aspect ratio 10: 1
      		Epoxy hole plug Y
      (2) min trace w/s for 1 OZ：2.5 mil/2.5mil
      Max finished copper thickness：18/18 oz
      		Solder mask hole plug Y

      (3) hole to line or pad spacing: min 6mil

      		Countersink/Conterbore Y
      7 Lamination

      (1) Max size can be laminated： 790 x 890 mm

      		Depth Control Drill and Rout Y

      (2) Layer to Layer Registration, tolerance：± 3 mil

      		Edge Metallized Y
      8 Drilling

      (1) min finished hole size: laser 0.1mm, mechanical 0.15mm

      		Thick hard gold plating 60U'

      (2) PTH hole size tolerance: ± 3 mil，

      NPTH hole size, tolerance: ± 2 mil

      hole position registration
      tolerance: ± 2 mil
      		Impedance +/‐ 5%
      (3) min slot size：0.55 mm Thick Copper 18OZ outer and inner layers
      9 Outer Layer (1) 1oz: 3/3 mil, 2oz：5/5 mil
      Max finished copper
      thickness：18/18 oz
      Thick hard gold fingers plating
      		60U'

      (2) Hole to line PAD 6 mil

      		Selective hard gold plating 60U'

      (3) line to outline > 10 mil

      		Thick ENIG 10U'
      10 Plating

      (1) hole wall copper thickness 1-10 mil

      		Selective flash gold Y

      (2) 10:1

      		Peelable solder mask Y
      11 Etch

      Etch tolerance： ±10%

      HDI
      12 Soldermask

      (1) min soldermaks bridge 4mil

      		min PAD 20 mil Item Max Capability

      (2) pad to outer layer line: 3mil, min ring 2 mil

      		Layer Count / Technology 4 - 20 Layers

      (3) soldermask thickness 0.4~1.0 mil

      		PCB Thickness Range 0.5 - 2.4 mm

      (4) soldermask color：green, blue, yellow,red, black,

      white, transparent and so on

      		Build Up Technology

      1+N+1

      1+1+N+1+1

      1+1+1+N+1+1+1
      13 ENIG+Gold Finger

      (1) Gold thickness of ENIG：1~ 6 u"，

      Nickle thickness of ENIG:100 ~ 200 u"

      		Min. Laser Drill Diameter 0.1 mm
      (2) gold thickness of gold finger; 1 ~ 60u" Laser Technology CO2 Direct Drilling (UV/CO2)
      14 Silkscreen
      (1) min line width：5 mil；line height：36 mil
      max line
      height: 40 mil
      		Hope Wall Copper Thickness 20 um

      (2) Silkscreen Color：white, black, yellow, red

      		Min. Line / Spacing 2.6/2.6 mil
      15 Profiling

      (1) Tolerance of outline: ± 0.1mm

      		Smallest Drill 0.2 mm
      (2) V-CUT Angle: 30 degree & 45 degree
      min V-Cut width
      75 MM
      Quality System and Certificates
      (3) Depth：Board thickness≧1.2 mm Remain thicknss: 1/3；

      Board thickness≦ 1.2 mm, remain thickness 20 mil (0.5 mm)

      min distance V-Cut to copper 0.4 MM

      		IPC‐600, 6012, Class II and III

      (4) Bevelling angle/depth: 20°/1.8 mm；30° /1.0 mm；

      45°/0.5 mm, tolerance：± 5°/± 0.2 mm

      ISO 9001:2008

        ISO 14001:2004

      16 Test

      (1) max test points/one time：50000

      		TS 16949:2009

      (2) max board size/one time: 1200x650 mm

      		UL: E326765
      17

      Peelable Thickness

      		0.2mil~ 2mil
      18 Bow and Twist

      1L≤1.0%   2L≤0.7%  Multi layers≤0.6%

      19 Monthly Capacity 40,000㎡