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Standard Capability
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PCB Technologies
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Item | Process | Manufacturing Capability | Remark | Item | Max Capability | |
1 | Surface Finishing |
HASL, HASL LF, ENIG, gold fingers plating, OSP, Immersion Ag, Immersion Sn, Carbon Ink, peelable mask, filling vias with resin |
Buried and Blind Vias | 2 steps | ||
2 | Board Thickness | 0.2 MM ~ 6.0 MM | Sequential lamination | Y | ||
3 | Layers | 1 ~ 28 L |
Mixed dielectric
/ Hybrid construction
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Aluminum-FR4, FR4- Rogers,Flex-FR4 |
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4 | Material |
KB,ITEQ,Shengyi,Huazheng,Nelco,Getek,CEM,Arlon,Rogers,Teflon,Polymide, Aluminum Base, Hilogen Free,Peters Soldermask, Taiyo Ink |
Aluminum Back PCB | Y | ||
TG: low to high, TG135 to TG180 |
Carbon Ink hole plug | Y | ||||
5 | Board Size |
Max board size:500 x 1200 MM; Min board size: 3*3 mm |
Silver Paste hole plug | Y | ||
6 | Inner Layer |
(1) ring of line: single sided 4mil |
Aspect ratio 10: 1
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Epoxy hole plug | Y | |
(2) min trace w/s for 1 OZ:2.5 mil/2.5mil |
Max finished copper thickness:18/18 oz
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Solder mask hole plug | Y | |||
(3) hole to line or pad spacing: min 6mil |
Countersink/Conterbore | Y | ||||
7 | Lamination |
(1) Max size can be laminated: 790 x 890 mm |
Depth Control Drill and Rout | Y | ||
(2) Layer to Layer Registration, tolerance:± 3 mil |
Edge Metallized | Y | ||||
8 | Drilling |
(1) min finished hole size: laser 0.1mm, mechanical 0.15mm |
Thick hard gold plating | 60U' | ||
(2) PTH hole size tolerance: ± 3 mil, NPTH hole size, tolerance: ± 2 mil |
hole position registration
tolerance: ± 2 mil
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Impedance | +/‐ 5% | |||
(3) min slot size:0.55 mm | Thick Copper | 18OZ outer and inner layers | ||||
9 | Outer Layer | (1) 1oz: 3/3 mil, 2oz:5/5 mil |
Max finished copper
thickness:18/18 oz
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Thick hard gold fingers plating
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60U' | |
(2) Hole to line PAD 6 mil |
Selective hard gold plating | 60U' | ||||
(3) line to outline > 10 mil |
Thick ENIG | 10U' | ||||
10 | Plating |
(1) hole wall copper thickness 1-10 mil |
Selective flash gold | Y | ||
(2) 10:1 |
Peelable solder mask | Y | ||||
11 | Etch |
Etch tolerance: ±10% |
HDI
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12 | Soldermask |
(1) min soldermaks bridge 4mil |
min PAD 20 mil | Item | Max Capability | |
(2) pad to outer layer line: 3mil, min ring 2 mil |
Layer Count / Technology | 4 - 20 Layers | ||||
(3) soldermask thickness 0.4~1.0 mil |
PCB Thickness Range | 0.5 - 2.4 mm | ||||
(4) soldermask color:green, blue, yellow,red, black, white, transparent and so on |
Build Up Technology |
1+N+1 1+1+N+1+1
1+1+1+N+1+1+1
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13 | ENIG+Gold Finger |
(1) Gold thickness of ENIG:1~ 6 u", Nickle thickness of ENIG:100 ~ 200 u" |
Min. Laser Drill Diameter | 0.1 mm | ||
(2) gold thickness of gold finger; 1 ~ 60u" | Laser Technology | CO2 Direct Drilling (UV/CO2) | ||||
14 | Silkscreen |
(1) min line width:5 mil;line height:36 mil
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max line
height: 40 mil
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Hope Wall Copper Thickness | 20 um | |
(2) Silkscreen Color:white, black, yellow, red |
Min. Line / Spacing | 2.6/2.6 mil | ||||
15 | Profiling |
(1) Tolerance of outline: ± 0.1mm |
Smallest Drill | 0.2 mm | ||
(2) V-CUT Angle: 30 degree & 45 degree |
min V-Cut width
75 MM
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Quality System and Certificates
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(3) Depth:Board thickness≧1.2 mm Remain thicknss: 1/3;
Board thickness≦ 1.2 mm, remain thickness 20 mil (0.5 mm) |
min distance V-Cut to copper 0.4 MM |
IPC‐600, 6012, Class II and III | ||||
(4) Bevelling angle/depth: 20°/1.8 mm;30° /1.0 mm; 45°/0.5 mm, tolerance:± 5°/± 0.2 mm |
ISO 9001:2008 ISO 14001:2004 |
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16 | Test |
(1) max test points/one time:50000 |
TS 16949:2009 | |||
(2) max board size/one time: 1200x650 mm |
UL: E326765 | |||||
17 |
Peelable Thickness |
0.2mil~ 2mil | ||||
18 | Bow and Twist |
1L≤1.0% 2L≤0.7% Multi layers≤0.6% |
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19 | Monthly Capacity | 40,000㎡ |